Ersa IR/PL650

The flexible rework powerhouse for challenging tasks

Flexible desoldering, placement and soldering of all types of surface mounted devices (SMD), especially: high mass BGA, metallic BGA, CGA, CCGA, BGA socket, multilayer boards or aluminium laminated substrate, BGA-multiway connector, large QFP, large PLCC, high pole THT components; for QFP components an optional split optics cassette is available.

• Four programmable heating zones in the top emitter 1,200 W

• Five programmable heating zones in the bottom emitter 3,200 W
• Integrated "DIGITAL 2000 A'' solder station for rework 
  and removal of residual solder
• Four thermocouple measuring channels and a non-contact IR sensor
• Dynamic IR heating technology for large (460 x 560 mm) PCBs
• High precision (+/- 0.025 mm) Auto Pick & Place with motor zoom AF camera
• Intuitive operation with PC connection
• Process control and documentation via the operator software IRSoft
• Motor zoom reflow process camera for process viewing